| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 24 Feb 2026 | SERC | Institute for Infocomm Research | AI-Powered Super-Resolution for Scalable and Efficient 3D X-Ray Inspection of 3D-Stacked HBMs | Yang Yu, Kangkang Lu, Jie Wang, Richard Chang, Meng Keong Lim, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |