| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 17 Jun 2026 | SERC | Institute of Microelectronics | High-Density, Energy-Efficient CPO Platform with PIC-in-Mold Interposer Architecture for AI/ML Data Centers (Pending publish) | Sajay Bhuvanendran Nair Gourikutty, Wu Jiaqi, Zhonghua Yang, Mihai Rotaru, Ji Lin, Han Yong, Chia Lai Yee, Sharon Lim, San Sandra, Chai Tai Chong, Surya Bhattacharya | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |