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Publication date Communities Collections Article title Author(s) Journal/Conference
28 May 2024 SERC Institute of Microelectronics Deep Reinforcement Learning-Based Power Distribution Network Design Optimization for Multi-Chiplet System Weiyang Miao, Zhen Xie, Chuan Seng Tan, Mihai Rotaru 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
11 Apr 2024 SERC Institute of Microelectronics Reliability Study of Two-Step Plasma-Activated Copper-Copper Direct Bonding in Ambient Liangxing Hu, Yu Dian Lim, Michael Joo Zhong Lim, Weiyang Miao, Van Quy Dinh, Zhen Xie, Qimiao Chen, Xin Ju, Chuan Seng Tan 2023 24th International Conference on Electronic Packaging Technology (ICEPT)
18 Jan 2023 SERC Institute of Microelectronics Comparative Study of Die-Attach Materials for LED Die Bonding Liangxing Hu, Shuyu Bao, Yue Wang, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Weiyang Miao, Van Quy Dinh, Sai Choo Tan, Kai Hwa Chew, Chuan Seng Tan 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)