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18 Mar 2024 SERC Institute of Microelectronics Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing (Pending publish) Simon Chun Kiat Goh, Cheemalamarri Hemanth Kumar, Liangxing Hu, Woon Shervonne, Norhanani Jaafar, Yap Lee Khoon Sherry, Ding Huang, Chit Siong Lau, Senthil Kumar Karuppannan, Hongyu Li, Chuan Seng Tan, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)