| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration | Xiangyu Wang, Mihai Dragos Rotaru, Yu Haitao, Mingchinq Jonq, Chai Tai Chong, King-Jien Chui | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |