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Publication date Communities Collections Article title Author(s) Journal/Conference
24 Feb 2026 SERC Institute for Infocomm Research Generative AI-Powered Defect Detection for 3D X-Ray Microscopy Scans of High Bandwidth Memory Bumps Richard Chang, Jie Wang, Yang Yu, Meng Keong Lim, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute for Infocomm Research AI-Powered Super-Resolution for Scalable and Efficient 3D X-Ray Inspection of 3D-Stacked HBMs Yang Yu, Kangkang Lu, Jie Wang, Richard Chang, Meng Keong Lim, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
11 Mar 2025 SERC Institute for Infocomm Research End-to-End Fast Segmentation Framework for 3D Visual Inspection of HBMs Jie Wang, Richard Chang, Meng Keong Lim, Ser Choong Chong, Xulei Yang, Ramanpreet Singh Pahwa 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
26 Jun 2024 SERC Institute of Microelectronics Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications Hemanth Kumar Cheemalamarri, Tran Van Nhat Anh, Chen Gim Guan, Meng Keong Lim, Srinivasa Rao Vempati, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)