| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 26 Jun 2024 | SERC | Institute of Microelectronics | Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications | Hemanth Kumar Cheemalamarri, Tran Van Nhat Anh, Chen Gim Guan, Meng Keong Lim, Srinivasa Rao Vempati, Navab Singh | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |