| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 11 Apr 2024 | SERC | Institute of Microelectronics | Reliability Study of Two-Step Plasma-Activated Copper-Copper Direct Bonding in Ambient | Liangxing Hu, Yu Dian Lim, Michael Joo Zhong Lim, Weiyang Miao, Van Quy Dinh, Zhen Xie, Qimiao Chen, Xin Ju, Chuan Seng Tan | 2023 24th International Conference on Electronic Packaging Technology (ICEPT) |
| 18 Jan 2023 | SERC | Institute of Microelectronics | Comparative Study of Die-Attach Materials for LED Die Bonding | Liangxing Hu, Shuyu Bao, Yue Wang, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Weiyang Miao, Van Quy Dinh, Sai Choo Tan, Kai Hwa Chew, Chuan Seng Tan | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |