| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 11 Mar 2025 | SERC | Institute of Microelectronics | Fabrication of c-Si Pillars on Glass Substrates for Terahertz Dielectric Metasurfaces Using Glass-Silicon Direct Bonding | Hemanth Kumar Cheemalamarri, B.S.S.Chandra Rao, Arvind Sundaram, Ho Sze Jye Jacky, Tee Soon Fong, Prakash Pitchappa, Nitin Muralidharan Nair, Navab Singh, Vempati Srinivasa Rao | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) |