Seit, W. W., Chong, S. C., Hong, C., Wai, E., & Ang, R. (2021). Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663979
Abstract:
In sensor application, there is a need to bond a silicon or glass die on another sensor die to form either the enclosed cavity for the sensor or to form a heterogeneous integration of two different devices. Chip to chip bonding can be applied either by polymer material such as die attach epoxy or solder material, or using hermetic method with frit glass material [1]. One of the attractive polymer material is the photosensitive polyimide (PSPI) [2]. In applications, PSPI is being applied as re-distribution layer for the package. Good adhesion to RDL is required for PSPI with low temperature curable nature [3]. PSPI can be patterned to form the cavity structure on the sensor device.The study presented in this paper is to investigate the bonding joint of chip by chip using PSPI adhesive film “X”. One of the challenges of adopting PSPI is that it must maintain good adhesion between the bonded interfaces. As such, comprehensive DOE run is carried out to obtain the most optimized parameters for the sample chip die attachment onto substrate. The bonded samples are able to pass the die shear strength criteria and withstand the wire bonding process without delamination.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Industry Alignment Fund – Pre-positioning (IAF-PP)
Grant Reference no. : A1789a0024