| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Jan 2023 | SERC | Institute of Microelectronics | Comparative Study of Die-Attach Materials for LED Die Bonding | Liangxing Hu, Shuyu Bao, Yue Wang, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Weiyang Miao, Van Quy Dinh, Sai Choo Tan, Kai Hwa Chew, Chuan Seng Tan | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |