| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 Oct 2026 | SERC | Institute of Advanced Intelligence and Computing | SWIFT-Place: Sequential Wirelength, Interposer Footprint, and Thermal-Aware Placement for 2.5D Advanced Packaging Systems (Pending publish) | Yubo Hou, Sezin Ata Kircali, Gen Liang Lim, Richard Chang, Mihai Dragos Rotaru, Dutta Rahul, Ashish James | 2026 International Symposium of Electronics Design Automation (ISEDA) |