| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 24 Feb 2026 | SERC | Institute for Infocomm Research | TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning (Pending publish) | Yubo Hou, Furen Zhuang, Partha Pratim Kundu, Sezin Ata Kircali, Jie Wang, Mihai Dragos Rotaru, Dutta Rahul, Ashish James | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |