| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 26 Jun 2025 | SERC | Institute of Microelectronics | Addressing Key Process Challenges in Developing High Aspect Ratio TSVs up to 15 with 1 μm Critical Dimension (Pending publish) | Tran Van Nhat Anh, Nandini Venkataraman, Ya-Ching Tseng, Arvind Sundaram, Binni Varghese, Heng Zeng Wei, B.S.S. Chandra Rao | 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |