| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 24 Feb 2026 | SERC | Institute of Microelectronics | Chip Stacking: Impact of Chip Spacing in C2W Hybrid Bonding on Temporary Bonding and Debonding (Pending publish) | Jaibir Sharma, Dileep Kumar Mishra, Vasarla Nagendra Sekhar, Bhesetti Chandra Rao | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |