| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 26 Jun 2025 | SERC | Institute of Microelectronics | Novel Selective Metal Capping on Cu pad Enabling Void-Free Hybrid Bonding at Low Thermal Budgets, Irrespective of Cu Topography and Microstructure | Hemanth Kumar Cheemalamarri, Masahisa Fujino, Chandra Rao Bhesetti, Lau Boon Long, Mishra Dileep, Srinivasa Rao Vempati, Navab Singh | 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |