Jaafar, N. B., Hongyu, L., Tseng, Y.-C., Ng, Y. C., & Lau, D. (2025). 2.5D Cryogenic Packaging for Advanced Quantum Processors. In (Editor), 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc67330.2025.11392196
Abstract:
2.5D packaging improves performance and power efficiency due to shorter connectivity distance, enhances signal integrity owing to reduce wiring lengths and higher integration densities. Current technologies cannot provide an integration technique that can handle thousands of single flux quantum devices required for operation. Other criteria include high integration density per chip, a reduced in size for cryogenic cooling system, low-resistance signal pathways, and reliability over cryogenic temperature ranges. 2.5D cryogenic integration approach reduces superconducting computing hardware to a small enough size to fit in a cryogenic chamber. In this publication, we demonstrated the assembly of 2.5D packaging integrating using a 100 um thick superconducting interposer with a qubit chip attached on top and a passive chip on the bottom. Interposer's peripheral is then, die attached and Aluminum (AI) wire bond onto the LTCC substrate
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the National Research Foundation, Singapore through the National Quantum Office - Quantum Engineering Programme 3.0 Funding Initiative (W24Q3D0003)
Grant Reference no. : W24Q3D0003