A Novel Packaging Solution for Photonic Engine Application

A Novel Packaging Solution for Photonic Engine Application

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

10.1109/EPTC59621.2023.10457566

http://dx.doi.org/10.1109/eptc59621.2023.10457566

Xu Feng, Li Zhenyu, Wen Lee

18 March 2024

Feng, X., Zhenyu, L., Lee, W. (2023, December 5). A Novel Packaging Solution for Photonic Engine Application. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457566

Silicon photonic is a very promising solution to meet the dramatical increase of bandwidth and the ultra-low power consumption demands for data centers and high-performance computing. One of the challenges on realization of final product is the packaging which integrate both electronics integrated circuits (EICs) and the photonics integrated circuits (PICs). A careful packaging solution should be developed to handle higher bandwidth at a cost of lower power consumption, or improper solution can negate all the possible benefit of silicon photonic. In this paper, we suggest a novel packaging solution by the combined method of flip-chip and wire-bonding to realize 400G data rate photonic engine.

Publisher Copyright

This research / project is supported by the A*STAR - EPHI (Electro-Photonic Heterogeneous Integration) FOR 1.6T Photonic Engine Platform
Grant Reference no. : NA

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