Process Optimization of Sc0.2Al0.8N Bimorph Stack Deposition on 200mm Si Wafer

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Process Optimization of Sc0.2Al0.8N Bimorph Stack Deposition on 200mm Si Wafer
Title:
Process Optimization of Sc0.2Al0.8N Bimorph Stack Deposition on 200mm Si Wafer
Journal Title:
2023 IEEE International Symposium on Applications of Ferroelectrics (ISAF)
Keywords:
Publication Date:
29 September 2023
Citation:
Liu, P., Li, M., Lin, H., Quek, Z. J., Varghese, B., & Zhu, Y. (2023, July 23). Process Optimization of Sc0.2Al0.8N Bimorph Stack Deposition on 200mm Si Wafer. 2023 IEEE International Symposium on Applications of Ferroelectrics (ISAF). https://doi.org/10.1109/isaf53668.2023.10265630
Abstract:
In this study, we investigated the microstructure and film properties of a bimorph structure with 20% Sc-doped AlN functional layers. The piezoelectric response of both the first and second Sc 0.2 Al 0.8 N films is obtained using DBLI method. Through deposition process optimization, we were able to ensure that the second Sc 0.2 Al 0.8 N layer exhibited comparable d 33,f and e 31,f value, crystallinity, and surface roughness as the first Sc 0.2 Al 0.8 N layer.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Ferroelectric Aluminum Scandium Nitride (Al1-xScxN) Thin Fi
Grant Reference no. : A20G9b0135
Description:
© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
2375-0448
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