Loh, W. L., Guan, L. T., & Chui, K.-J. (2021). A 2.5D Heterogeneous Integration Demonstration for High Performance RF Application using High-Resistivity Through Si Interposer (TSI). 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663901
Abstract:
In this paper, a 2.5D high-resistivity through-Si-interposer (TSI) is demonstrated to integrate multi-functional dies from different device technologies (such as GaN HEMT and Si/SiGe amplifiers) for high performance RF applications. Such integration schemes allow for compact, small form-factor design in airborne radar and communication.