Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
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5 Jan 2022 | SERC | Institute of Microelectronics | A 2.5D Heterogeneous Integration Demonstration for High Performance RF Application using High-Resistivity Through Si Interposer (TSI) | Woon Leng Loh, Lim Teck Guan, K.-J. Chui | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |