| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | A 2.5D Heterogeneous Integration Demonstration for High Performance RF Application using High-Resistivity Through Si Interposer (TSI) | Woon Leng Loh, Lim Teck Guan, K.-J. Chui | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| 5 Jan 2022 | SERC | Institute of Microelectronics | Numerical study on wafer level warpage evolution during chip to wafer hybrid bonding process | Lin Ji, Masaya Kawano, Sasi Kumar Tippabhotla, Woon Leng Loh | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| 30 May 2017 | SERC | Institute of Microelectronics | A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) | Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu, King-Jien Chui | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |