Systematic Signal Integrity Analysis on Fine Pitch Probe Card for HBM Interposer Testing

Systematic Signal Integrity Analysis on Fine Pitch Probe Card for HBM Interposer Testing

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

10.1109/EPTC53413.2021.9663999

http://dx.doi.org/10.1109/eptc53413.2021.9663999

Li Kangrong, Ratan Bhimrao Umralkar

05 January 2022

Kangrong, L., & Umralkar, R. B. (2021). Systematic Signal Integrity Analysis on Fine Pitch Probe Card for HBM Interposer Testing. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663999

High bandwidth memory (HBM) has overcome the limitations of conventional DRAMs. It can support terabyte/s data transmission between GPU and HBMs with 2.5D packaging technology. To ensure the high-speed data transmission between the HBM and GPU, the signal integrity (SI) of the HBM interposer with many I/O interconnects needs to be tested with the customized fine-pitch probe card. However, SI problem is found on the probe card when the full-wafer SI test is performed on the HBM interposer. This paper demonstrates that the SI of the probe card for HBM interposer testing needs to be considered. Moreover, this paper introduces a comprehensive methodology to discover and localize the SI problem in the HBM interposer testing through the systematic SI analysis.

Publisher Copyright

This research / project is supported by the A*STAR - More-Than-Moore Design-For-Test Centre of Excellence
Grant Reference no. : 1525700050

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Institute of Microelectronics