A Robust Bilayer Cap in Thin Film Encapsulation for MEMS Device Application

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A Robust Bilayer Cap in Thin Film Encapsulation for MEMS Device Application
Title:
A Robust Bilayer Cap in Thin Film Encapsulation for MEMS Device Application
Journal Title:
IEEE Transactions on Components, Packaging and Manufacturing Technology
Keywords:
Publication Date:
09 June 2015
Citation:
Sharma, J.; Jae-Wung Lee; Merugu, S.; Singh, N., "A Robust Bilayer Cap in Thin Film Encapsulation for MEMS Device Application," in Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.5, no.7, pp.930-937, July 2015 doi: 10.1109/TCPMT.2015.2402296
Abstract:
Thin-film encapsulation (TFE) is one of the promising wafer-level packaging techniques for microelectromechanical systems (MEMS) devices. One of the drawbacks of TFE is that it is difficult to encapsulate large MEMS devices due to the downward deformation of the cap layer during the release of the TFE. This paper presents a robust bilayer cap made out of aluminum nitride (AlN)/nickel (Ni) layers, which can solve the problem of downward deformation of the cap layer. This bilayer cap provides both strength and flexibility to the TFE. This bilayer cap is simulated using ANSYS and experimentally demonstrated by encapsulating cavities as large as 1200 μm × 1200 μm with 0.5 μm AlN/0.7 μm Ni, whereas even 400 μm × 400 μm-sized TFE cannot be fabricated without cracks with a solitary 1-μm-thick AlN cap layer. Standard microfabrication processes are used for the fabrication of this bilayer cap.
License type:
PublisherCopyrights
Funding Info:
Description:
(c) 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
ISSN:
2156-3950
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