| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | Reliability life assessment and prediction for high density FOWLP package using finite element analysis and statistical approach | Lin Ji, Tai Chong Chai | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |