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Publication date Communities Collections Article title Author(s) Journal/Conference
13 Jun 2024 SERC Institute of Materials Research and Engineering High Thermoelectric Performance in Rhombohedral GeSe-LiBiTe2 Jinfeng Dong, Yukun Liu, Zhi Li, Hongyao Xie, Yilin Jiang, Honghui Wang, Xian Yi Tan, Ady Suwardi, Xiaoyuan Zhou, Jing-Feng Li, Christopher Wolverton, Vinayak P Dravid, Qingyu Yan, Mercouri G. Kanatzidis Journal of the American Chemical Society
30 Mar 2024 SERC Institute of Materials Research and Engineering Synergistic Combination of Sb2Si2Te6 Additives for Enhanced Average ZT and Single-Leg Device Efficiency of Bi0.4Sb1.6Te3-based Composites Xian Yi Tan, Jinfeng Dong, Jiawei Liu, Danwei Zhang, Samantha Faye Duran Solco, Kıvanç Sağlık, Ning Jia, Ivan Joel Wen Jie You, Sheau Wei Chien, Xizu Wang, Lei Hu, Yubo Luo, Yun Zheng, Debbie Xiang Yun Soo, Rong Ji, Ken Choon Hwa Goh, Yilin Jiang, Jing‐Feng Li, Ady Suwardi, Qiang Zhu, Jianwei Xu, Qingyu Yan Advanced Science
10 Jan 2024 SERC Institute of Materials Research and Engineering Off-Centering of Ge Atoms in GeBi2Te4 and Impact on Thermoelectric Performance Jinfeng Dong, Lei Hu, Jue Liu, Yukun Liu, Yilin Jiang, Zhiling Yu, Xian Yi Tan, Ady Suwardi, Qiang Zheng, Qian Li, Jing‐Feng Li, Vinayak P. Dravid, Qingyu Yan, Mercouri G. Kanatzidis Advanced Functional Materials
30 Nov 2023 SERC Institute of Materials Research and Engineering Thermoelectric coupling effect in BNT-BZT-xGaN pyroelectric ceramics for low-grade temperature-driven energy harvesting Meng Shen, Kun Liu, Guanghui Zhang, Qifan Li, Guangzu Zhang, Qingfeng Zhang, Haibo Zhang, Shenglin Jiang, Yong Chen, Kui Yao Nature Communications
3 Aug 2023 SERC Institute of Microelectronics On the effect of partial underfilling on the fatigue life of flip-chip micro-solder bumps in a heterogeneously integrated TSI package using finite element simulations Sasi Kumar Tippabhotla, Lin Ji 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
1 Apr 2022 SERC Institute for Infocomm Research Towards high performance homomorphic encryption for inference tasks on CPU: An MPI approach Souhail Meftah, Benjamin Hong Meng Tan, Khin Mi Mi Aung, Lu Yuxiao, Lin Jie, Bharadwaj Veeravalli Future Generation Computer Systems
5 Jan 2022 SERC Institute of Microelectronics A comparative study of stress-based and fracture mechanics-based finite element simulation approaches for RDL based wafer level package Sasi Kumar Tippabhotla, Lin Ji, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Numerical study on wafer level warpage evolution during chip to wafer hybrid bonding process Lin Ji, Masaya Kawano, Sasi Kumar Tippabhotla, Woon Leng Loh 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Reliability life assessment and prediction for high density FOWLP package using finite element analysis and statistical approach Lin Ji, Tai Chong Chai 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
21 May 2021 BMRC Skin Research Institute of Singapore A flexible multiplexed immunosensor for point-of-care in situ wound monitoring Yuji Gao, Dat T. Nguyen, Trifanny Yeo, Su Bin Lim, Wei Xian Tan, Leigh Edward Madden, Lin Jin, Ji Yong Kenan Long, Fazila Abu Bakar Aloweni, Yi Jia Angela Liew, Mandy Li Ling Tan, Shin Yuh Ang, Sivagame D/O Maniya, Ibrahim Abdelwahab, Kian Ping Loh, Chia-Hung Chen, David Laurence Becker, David Leavesley, John S. Ho, Chwee Teck Lim Science Advances