| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 3 Aug 2023 | SERC | Institute of Microelectronics | Assembly Challenges and Approaches for 2.5D Chiplet Based System | Sharon PeiSiang Lim, Mihai D. Rotaru, Wenwei Seit, Hsiao Hsiang Yao | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |