| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 3 Aug 2023 | SERC | Institute of Microelectronics | Assembly Challenges and Approaches for 2.5D Chiplet Based System | Sharon PeiSiang Lim, Mihai D. Rotaru, Wenwei Seit, Hsiao Hsiang Yao | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| 5 Jan 2022 | SERC | Institute of Microelectronics | Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging | Lau Boon Long, David Ho, Lim Teck Guan, Hsiao Hsiang Yao, Lim Pei Siang, Norhanani Jaafar | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |