| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Polymer Based Dual Damascene Process for Fine Pitch RDL Advanced Packaging | Hsiao Hsiang-Yao, Ryan Ley, Peng Suo, Andy Yong Chang Bum, Roger Quon | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |