Hsiang-Yao, H., Ley, R., Suo, P., Bum, A. Y. C., Quon, R. (2023, December 5). Polymer Based Dual Damascene Process for Fine Pitch RDL Advanced Packaging. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457887
Abstract:
In this paper, a trench-first dual damascene process is used to demonstrate 1 μm L/S meander trenches and 1 μm CD and space vias. A non-phototype polymer material is selected as the dielectric layer and two layers of 1 μm dielectric are spin-coated. The issues and costs associated with the chemical mechanical planarization (CMP) process are eliminated. In the lithography process, a 1.5 μm thick photoresist was spin-coated using optimized exposure energy patterns of 1 μm L/S trench and 1 μm CD and space vias, respectively. Finally, dry etch parameters were fine-tuned to complete etching of 1 μm L/S meander trenches and 1 μm CD and space vias.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Applied Centre of Excellence in Advanced Packaging 3.0. (CEAP 3.0)
Grant Reference no. : I2101E0008