| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 11 Apr 2024 | SERC | Institute of Microelectronics | Reliability Study of Two-Step Plasma-Activated Copper-Copper Direct Bonding in Ambient | Liangxing Hu, Yu Dian Lim, Michael Joo Zhong Lim, Weiyang Miao, Van Quy Dinh, Zhen Xie, Qimiao Chen, Xin Ju, Chuan Seng Tan | 2023 24th International Conference on Electronic Packaging Technology (ICEPT) |