| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Physical Verification for 3D Heterogeneous Integrated Electronic Photonic Integration designs using equation-based methods for Non-Manhattan structures | Raju Mani, Sajay Bhuvanendran Nair Gourikutty, Rahul Dutta, Jason Liow | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |