Physical Verification for 3D Heterogeneous Integrated Electronic Photonic Integration designs using equation-based methods for Non-Manhattan structures
Page view(s)
13
Checked on Aug 31, 2025
Physical Verification for 3D Heterogeneous Integrated Electronic Photonic Integration designs using equation-based methods for Non-Manhattan structures
Physical Verification for 3D Heterogeneous Integrated Electronic Photonic Integration designs using equation-based methods for Non-Manhattan structures
Mani, R., Nair Gourikutty, S. B., Dutta, R., Liow, J. (2023, December 5). Physical Verification for 3D Heterogeneous Integrated Electronic Photonic Integration designs using equation-based methods for Non-Manhattan structures. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457712
Abstract:
To effectively manage substantial data traffic in the data
centre, the use of high-performance optical transceivers known as optical engines is essential.
Optical engines are 3D integrated with Electronics and Photonics ICs employing advanced packaging
will provide high performance in a compact form factor that can be fabricated at wafer-level. For
such packages, there is an increasing demand to verify the process design rules in an automated way
to prepare compliant mask layouts for reliable fabrication. More than 3X reduction on false
violation is reduced by using Equation
based rule methods on physical verification.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Science and Engineering Research Council - Scalable Electronics-Photonics Integration enabled by Advanced Packaging
Grant Reference no. : I2001E0071