| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application | Wen Wei Seit, Ser Choong Chong, Cai Hong, Eva Wai, Rachel Ang | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |