Feng, H., Tang, G., & Tan, W. K. (2025). Magnetohydrodynamic-Driven Liquid Metal Cooling for High-Power Electronics. In (Editor), 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc67330.2025.11392327
Abstract:
Continuous scaling of high-power electronics requires efficient cooling solutions. We hereby present a compact and integrable magnetohydrodynamic (MHD)-driven liquid metal (GaInSn) cooling system fully embedded in printed circuit boards (PCBs). Theoretical models for pressure head and flowrate are derived, showing that the pressure head is proportional to both the magnetic field and electrode current, and inversely proportional to the square of the channel height. The flowrate is proportional to the magnetic field, electrode current, and channel cross-sectional area, while being limited by viscous and geometric flow resistance. Numerical simulations are conducted to optimize the cooling loop and reveal that rectangular loops show better performance than square loops. Wetting tests reveal poor GaInSn wettability on nickel plating but excellent wettability on gold-plating. Consequently, gold plating is adopted in an MHD cooling system incorporating permanent magnets. Its testing demonstrates the strong cooling capability of the liquid metal loop. Future PCB-based test vehicles will adopt gold plating for improved cooling efficiency and higher system integration.
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Funding Info:
This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Use-Inspired Basic Research Fund
Grant Reference no. : SC24/25-1218UI
This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Applied Centre of Excellence in Advanced Packaging 3.0
Grant Reference no. : I2101E0008