Yeo, Y. X., Leong Ching Wai, E., Chen, D. S.-H., Choong Chong, S. (2023, December 5). Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457764
Abstract:
A thin bonding interface that is void-free and composed of
materials with low attenuation is needed to achieve GHz bulk acoustic wave signal transmission for
analog computing accelerators. The presence of voids in the bonding interface would have
significant attenuation of acoustic transmission, which often results in complete reflection of the
acoustic signal. Thus, we aimed to develop a bonding process via heterogeneous integration
involving MEMS and CMOS components, with a total absence of air bubbles between the bonded
surfaces in the ambient air process. This paper presents the use of various methods including
preform and thermocompression bonding to facilitate void-free bonding, enabling low attenuation for
acoustic transmission through the sample and die-attach layers. From the results, it was found that
TCB between Au and AuSn surface resulted in the least
loss of signal.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - RIE 2020 Advanced Manufacturing and Engineering Programmatic -Ultrasonic Wavefront Computing
Grant Reference no. : A19E8b0102