| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | Development of TSV electroplating process for via-last technology | Gilho Hwang, Ravanethran Kalaiselvan | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |