| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Development of Metallization Process for Fine Pitch TSV | Gilho Hwang, Ji Hong Miao, B.S.S Chandra Rao | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| 30 May 2017 | SERC | Institute of Microelectronics | Development of TSV electroplating process for via-last technology | Gilho Hwang, Ravanethran Kalaiselvan | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |