| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | A Novel Packaging Solution for Photonic Engine Application | Xu Feng, Li Zhenyu, Wen Lee | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |