| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Sep 2015 | SERC | Institute of Microelectronics | Stress Analysis and Design Optimization for Low-k Chip With Cu Pillar Interconnection | Lin Jong-Kai, Au Keng Yuen, Hsiao Hsiang-Yao, Zhang Xiaowu, Che Fa Xing | IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY |
| 1 Aug 2014 | SERC | Institute of Microelectronics | Dynamic Stress Modeling on Wafer Thinning Process and Reliability Analysis for TSV Wafer | Che Fa Xing | IEEE Transactions on Components, Packaging and Manufacturing Technology (Volume: 4, Issue: 9) |