| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 17 Jun 2026 | SERC | Institute of Microelectronics | Enhancing Warpage Predictability by Considering Thermal Aging Shrinkage of EMC in Heterogeneous Integration Wafer Level Packaging (Pending publish) | Lin Ji, Alfred Yeo, Yifan Wang, Chan Kai Chong | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |