Mithal, A., Maharjan, N., & Idapalapati, S. (2023). Enhanced cooling rates in laser directed energy deposition with interlayer peening. Rapid Prototyping Journal. https://doi.org/10.1108/rpj-11-2022-0395
Abstract:
Purpose
This study aims to investigate the effect of mechanical peening on the cooling rate of a subsequently deposited layer in a hybrid additive manufacturing (AM) process.
Design/methodology/approach
In this experimental study, 20 layers of 316 L stainless steel are built via directed energy deposition, with the tenth layer being subject to various peening processes (shot peening, hammer peening and laser shock peening). The microstructure of the eleventh layer of all the samples is then characterized to estimate the cooling rate.
Findings
The measurements indicate that the application of interlayer peening causes a reduction in primary cellular arm spacing and an increase in micro segregation as compared to a sample prepared without interlayer peening. Both factors indicate an increase in the cooling rate brought about by the interlayer peening.
Practical implications
This work provides insight into process design for hybrid AM processes as cooling rates are known to influence mechanical properties in laser-based AM.
Originality/value
To the best of the authors’ knowledge, this work is the first of its kind to evaluate the effects of interlayer peening on a subsequently deposited layer in a hybrid AM process.
License type:
Attribution-NonCommercial 4.0 International (CC BY-NC 4.0)
Funding Info:
The funding support from Advanced Remanufacturing Technology Centre (ARTC), Singapore and Nanyang Technological University is gratefully acknowledged. Abeer acknowledges the financial support from A*STAR Graduate Academy (AGA), Singapore in the form of a PhD scholarship.
Description:
This author accepted manuscript is deposited under a Creative Commons Attribution Non-commercial 4.0 International (CC BY-NC) licence. This means that anyone may distribute, adapt, and build upon the work for non-commercial purposes, subject to full attribution. If you wish to use this manuscript for commercial purposes, please contact permissions@emerald.com'