Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration

Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration

2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

10.1109/EDTM50988.2021.9421033

http://dx.doi.org/10.1109/edtm50988.2021.9421033

Masaya Kawano

12 May 2021

Kawano, M. (2021). Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration. 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). https://doi.org/10.1109/edtm50988.2021.9421033

This paper describes various packaging technologies and their trends for next generation heterogeneous integration. The new technologies fill the interconnect gap between chip and package to meet industry requirement of high density heterogeneous integration.

Publisher Copyright

This research is supported by core funding from: Institute of Microelectronics
Grant Reference no. : N.A.

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https://oar.a-star.edu.sg/communities-collections/articles/18441

978-1-7281-8176-9

Institute of Microelectronics