| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Jan 2023 | SERC | Institute for Infocomm Research | Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach | Wang Jie, Richard Chang, Xu Xun, Cai Lile, Chuang Sheng Foo, Ramanpreet Singh Pahwa | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| 12 Jul 2022 | SERC | Institute for Infocomm Research | Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning | Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Xu Xun, Oo Zaw Min, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |