Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
1 May 2019 | SERC | Institute of Microelectronics | Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design | Gongyue Tang, Tai Chong Chai, Xiaowu Zhang | IEEE Transactions on Components, Packaging and Manufacturing Technology |