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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Jan 2023 SERC Institute for Infocomm Research Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach Wang Jie, Richard Chang, Xu Xun, Cai Lile, Chuang Sheng Foo, Ramanpreet Singh Pahwa 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
12 Jul 2022 SERC Institute for Infocomm Research Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Xu Xun, Oo Zaw Min, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
28 Jun 2021 SERC Institute for Infocomm Research Transfer Learning-Based Artificial Intelligence-Integrated Physical Modeling to Enable Failure Analysis for 3 Nanometer and Smaller Silicon-Based CMOS Transistors Jieming Pan, Kain Lu Low, Joydeep Ghosh, Senthilnath Jayavelu, Md Meftahul Ferdaus, Shang Yi Lim, Evgeny Zamburg, Yida Li, Baoshan Tang, Xinghua Wang, Jin Feng Leong, Savitha Ramasamy, Tonio Buonassisi, Chen-Khong Tham, Aaron Voon-Yew Thean ACS Applied Nano Materials