| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | FOWLP and Si-Interposer for High-Speed Photonic Packaging | Lim Teck Guan, Eva Wai Leong Ching, Jong Ming Ching, Loh Woon Leng, David Ho Soon Wee, Surya Bhattacharya | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| 23 Mar 2021 | SERC | Institute of Materials Research and Engineering | Integrated avalanche photodetectors for visible light | Salih Yanikgonul, Victor Leong, Jun Rong Ong, Ting Hu, Shawn Yohanes Siew, Ching Eng Png, Leonid Krivitsky | Nature Communications |