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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Jan 2023 SERC Institute for Infocomm Research Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach Wang Jie, Richard Chang, Xu Xun, Cai Lile, Chuang Sheng Foo, Ramanpreet Singh Pahwa 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
12 Jul 2022 SERC Institute for Infocomm Research Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Xu Xun, Oo Zaw Min, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
21 Jun 2022 SERC Institute for Infocomm Research A Simulation Approach to Analyze Bridge-Defects in a 6T-SRAM Bit Cell Joydeep Ghosh, Shang Yi Lim, Ferdaus Md. Meftahul, Senthilnath Jayavelu, Aaron Voon-Yew Thean 2022 6th IEEE Electron Devices Technology Manufacturing Conference (EDTM)
10 Nov 2020 SERC Institute for Infocomm Research A Hybrid Deep Learning Based Framework for Component Defect Detection of Moving Trains Cen Chen, Kenli Li, Zhongyao Cheng, Francesco Piccialli, Steven C. H. Hoi, Zeng Zeng IEEE Transactions on Intelligent Transportation Systems
27 Oct 2019 SERC Institute for Infocomm Research FaultNet: Faulty Rail-Valves Detection using Deep Learning and Computer Vision Ramanpreet Pahwa, Jin Chao, Jestine Paul, Yiqun Li, Tin Lay Nwe Ma, Shudong Xie, Ashish James, Arulmurugan Ambikapathi, Zeng Zeng, Vijay Chandrasekhar IEEE-ITSC 2019