| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors | Jinghui Xu, Zhipeng Ding, Vivek Chidambaram, Hongmiao Ji, Yuandong Gu | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |