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30 May 2017 SERC Institute of Microelectronics High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors Jinghui Xu, Zhipeng Ding, Vivek Chidambaram, Hongmiao Ji, Yuandong Gu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)