| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) | Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu, King-Jien Chui | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| 30 May 2017 | SERC | Institute of Microelectronics | Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package | Zhaohui Chen, Faxing Che, Mian Zhi Ding, David Soon Wee Ho, Tai Chong Chai, Vempati Srinivasa | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| 1 Aug 2014 | SERC | Institute of Microelectronics | Investigation on Reliability of Embedded Ultrathin Sensor Chip in Organic Substrate Under Drop Impact Loading by Stresses Monitor and FEM Simulation | Zhaohui Chen, Xiaowu Zhang | IEEE Transactions on Components, Packaging and Manufacturing Technology |