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Publication date Communities Collections Article title Author(s) Journal/Conference
28 May 2022 SERC Institute for Infocomm Research Algorithms and architecture support of degree-based quantization for graph neural networks Yilong Guo, Yuxuan Chen, Xiaofeng Zou, Xulei Yang, Yuandong Gu Journal of Systems Architecture
17 Sep 2019 SERC Institute of Microelectronics Large-area pixelated metasurface beam deflector on a 12-inch glass wafer for random point generation Nanxi Li, Yuan Hsing Fu, Yuan Dong, Ting Hu, Zhengji Xu, Qize Zhong, Dongdong Li, Keng Heng Lai, Shiyang Zhu, Qunying Lin, Yuandong Gu, Navab Singh Nanophotonics
28 Aug 2019 SERC Institute of Microelectronics CMOS-compatible all-Si metasurface polarizing bandpass filters on 12-inch wafers Zhengji Xu, Yuan Dong, Chih-Kuo Tseng, Ting Hu, Jinchao Tong, Qize Zhong, Nanxi Li, Larry Sim, Keng Heng Lai, Ying Lin, Dongdong Li, Yu Li, Bliznetsov Vladimir, Yuan-Hsing Fu, Shiyang Zhu, Qunying Lin, Dao Hua Zhang, Yuandong Gu, Navab Singh, Dim-Lee Kwong Optics Express
1 Jun 2019 SERC Institute of Microelectronics Over 10% of k2eff Demonstrated by 2-GHz Spurious Mode-Free Sc0.12Al0.88N Laterally Coupled Alternating Thickness Mode Resonators Nan Wang, Yao Zhu, Geng Li Chua, Bangtao Chen, Srinivas Merugu, Navab Singh, Yuandong Gu IEEE Electron Device Letters
23 Jul 2018 SERC Institute of Microelectronics Demonstration of color display metasurfaces via immersion lithography on a 12-inch silicon wafer Ting Hu, Chih-Kuo Tseng, Yuan Hsing Fu, Zhengji Xu, Yuan Dong, Shijie Wang, Keng Heng Lai, Vladimir Bliznetsov, Shiyang Zu, Qunying Lin, Yuandong Gu Optics Express
1 Apr 2018 SERC Institute of Microelectronics Wafer-Level Vacuum-Packaged High Performance AlN-on-SOI Piezoelectric Resonator for Sub-100 MHz Oscillator Applications Guoqiang Wu, Jinghui Xu, Xiaolin Zhang, Nan Wang, Danlei Yan, Jayce Lay Keng Lim, Yao Zhu, Wei Li, Yuandong Gu IEEE Transactions on Industrial Electronics
1 Oct 2017 SERC Institute of Microelectronics ScAlN-based LCAT Mode Resonators Above 2 GHz with High FOM and Reduced Fabrication Complexity Yao Zhu, Nan Wang, Gengli Chua, Chengliang Sun, Navab Singh, Yuandong Gu IEEE Electron Device Letters
30 May 2017 SERC Institute of Microelectronics High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors Jinghui Xu, Zhipeng Ding, Vivek Chidambaram, Hongmiao Ji, Yuandong Gu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding Qingxin Zhang, Yuandong Gu, Nan Wang, Li Yan Siow, Lionel You Liang Wong, Chengliang Sun, Hongmiao Ji, Darmayuda I Made, Peter Chang 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
25 Mar 2017 SERC Institute of Microelectronics A dual-mass fully decoupled MEMS gyroscope with wide bandwidthand high linearity Guoqiang Wu, Geng Li Chua, Yuandong Gu Sensors and Actuators A: Physical