| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 14 Apr 2016 | SERC | Institute of Microelectronics | Wafer-Scale Dies-Transfer Bonding Technology for Hybrid III/V-on-Silicon Photonic Integrated Circuit Application | Yuanbing Cheng, Xianshu Luo, Junfeng Song, Tsung-Yang Liow, Qi Jie Wang, Mingbin Yu | IEEE Journal of Selected Topics in Quantum Electronics |